Shenzhen Jufeng Solder Co., Ltd.
Main products:solder wire,solder bar,solder paste
Products
Contact Us
  • Contact Person : Ms. Chen Lisa
  • Company Name : Shenzhen Jufeng Solder Co., Ltd.
  • Tel : 086-0755-89501587-809
  • Fax : 086-0755-89501292
  • Address : Guangdong,shenzhen,12#JingPeng Industry BuJI town Longgang Distric , Shenzhen
  • Country/Region : China
  • Zip : 518129

high temperature with halogen free tin solder paste for printing

high temperature with halogen free tin solder paste for printing
Product Detailed
high temperature with halogen free tin solder paste for printing 1.high melting point 2.less dross 3.halogen free 4.lead fre

  

Shenzhen Jufeng Tin Product Co., Ltd. is specialized in producing and selling tin products, such as tin solder bars, tin solder wires, tin fat, anode stubs, soldering flux, apply machine water and cleaning agents. Our products are widely applicable to welding engineering of electron, communication, electric appliances, electric instruments and meters. 

Lead-free Solder PasteAlloy CompositionSn-3.5Ag \ Sn-0.7Cu \ Sn-Ag-Cu \ Sn-58BiLead-Contained Solder PasteAlloy CompositionSn63/Pb37 \ Sn62/Pb36/Ag2 \ Sn43/Pb43/Bi14 Sn10/Pb88/Ag2Basic concept and characteristic of Solder PasteSolder paste is a cream-like mixture of solder alloy powder and flux/vehicle system;Solder paste should be rheological, i.e., its viscosity will decrease under the action of shear stress to favor the printing process but recover afterward to help to fix the electronic components before reflow;During the reflow process, the flux system will remove the surface oxidation layer and then the molten solder alloy will wet and react with the component terminal and metal pad on PCB and finally form the mechanical and electrical joining. Lead-free Solder PasteAlloy CompositionSn-3.5Ag \ Sn-0.7Cu \ Sn-Ag-Cu \ Sn-58BiLead-Contained Solder PasteAlloy CompositionSn63/Pb37 \ Sn62/Pb36/Ag2 \ Sn43/Pb43/Bi14 Sn10/Pb88/Ag2Basic concept and characteristic of Solder PasteSolder paste is a cream-like mixture of solder alloy powder and flux/vehicle system;Solder paste should be rheological, i.e., its viscosity will decrease under the action of shear stress to favor the printing process but recover afterward to help to fix the electronic components before reflow;During the reflow process, the flux system will remove the surface oxidation layer and then the molten solder alloy will wet and react with the component terminal and metal pad on PCB and finally form the mechanical and electrical joining.

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