Shenzhen Jufeng Solder Co., Ltd.
Main products:solder wire,solder bar,solder paste
Products
Contact Us
  • Contact Person : Ms. Chen Lisa
  • Company Name : Shenzhen Jufeng Solder Co., Ltd.
  • Tel : 086-0755-89501587-809
  • Fax : 086-0755-89501292
  • Address : Guangdong,shenzhen,12#JingPeng Industry BuJI town Longgang Distric , Shenzhen
  • Country/Region : China
  • Zip : 518129

lead free bga solder paste for SMT screen printing

lead free bga solder paste for SMT screen printing
Product Detailed
LED light and SMT lead free bga solder paste. 1.High viscosity 2.high melting point 3.Lead-free Solder Paste 4..halogen

Shenzhen Jufeng Tin Product Co., Ltd. is specialized in producing and selling tin products, such as tin solder bars, tin solder wires, tin fat, anode stubs, soldering flux, apply machine water and cleaning agents. Our products are widely applicable to welding engineering of electron, communication, electric appliances, electric instruments and meters

Lead-free Soldering Paste(tin solder paste)Alloy Composition(welding paste alloy)Sn-3.5Ag \ Sn-0.7Cu \ Sn-Ag-Cu \ Sn-58BiLead-Contained Solder PasteAlloy CompositionSn63/Pb37 \ Sn62/Pb36/Ag2 \ Sn43/Pb43/Bi14 Sn10/Pb88/Ag2Basic concept and characteristic of Solder PasteSolder paste is a cream-like mixture of solder alloy powder and flux/vehicle system;Solder paste should be rheological, i.e., its viscosity will decrease under the action of shear stress to favor the printing process but recover afterward to help to fix the electronic components before reflow;During the reflow process, the flux system will remove the surface oxidation layer and then the molten solder alloy will wet and react with the component terminal and metal pad on PCB and finally form the mechanical and electrical joining.

Sorts of Solder PasteBy solder alloy composition, Pb-contained or Pb-free solder paste;By cleaning method, Rosin based, water soluble or no-clean solder paste;By flux type, Rosin, Rosin Medium Activated, Rosin Activated or Organic based solder paste;By applying method, solder paste for stencil printing, screen printing or syringe dispensing.

Sort

 (°C)

Melting Point

g/cm3

Spec. Gravity

 MPa

Tensile Strength

Sn99-Ag0.3-Cu0.7

217-227

7.40

51.3

lead free bga solder paste for SMT screen printing



Copyright Notice @ 2008-2012 ECVERY Limited and/or its subsidiaries and licensors. All rights reserved.