PCB Welding Flux tin lead Soldering Paste for mid temperature

Lead-free solder paste Sn63Pb37 1.containing halogen good weldability 2.high residual resistance no-clean rosin

Item name:   Welding Flux tin lead Soldering Paste for mid temperature  

Alloy: Sn63Pb37

Validity of slder paste:6moths

Weight: 500 grams/bottle,10kg/ctn

 

Feature

1.material:alloy composition with tin and lead.

 

2.packing: 500 grams/bottle,10kg/ctn

 

3.suitability:suitable for cell phone PCB and SMD repair etc.

 

4.certificate:ISO9001:2008;Original Certificate.

 

5.It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue,so you are easy to clean the board.

 

            DESCRIPTION

1. Introduction

Tin lead solder paste is designed disposable production technology for today's SMT type of a no-clean solder paste, solder paste using a special soldering paste and oxide content and a small ball made of tin powder refining. Excellent continuous printing . In addition, this product contains more flux, with high reliability, low ionic activator system, so that it possessed very little residue after reflow very high insulation resistance, with high reliability.

2.Chemical compositions

Sort	Chemical composition (wt.%)
	Sn	Bi	Sb	Pb	Fe	Al	Cd
Sn63Pb37	63	<0.005	<0.02	Bal	<0.02	<0.002	<0.003

Technical parameters

Model	JF800902	JF800905	JF800903	JF800904	JF800901
Alloy Composition	Sn96.5Ag3.0Cu0.5	Sn99Ag0.3Cu0.7	Sn42Bi58	Sn64Bi35Ag1	Sn63Pb37
Melting Point	217°C	219°C	138°C	139°C	183°C
Powder Specification	25-45mm	25-45mm	25-45mm	25-45mm	20-38mm
Flux Content	9.0%-9.5%	9.0%-9.5%	9.0%-9.5%	9.0%-9.5%	9.0%-9.5%
Viscosity	190pa.s-210pa.s	190pa.s-210pa.s	190pa.s-210pa.s	190pa.s-210pa.s	190pa.s-210pa.s
Solder ball Test	Qualified	Qualified	Qualified	Qualified	Qualified
Expansion Rate	Qualified	Qualified	Qualified	Qualified	Qualified

   Welding Flux tin lead Soldering Paste for mid temperature  

PCB Welding Flux tin lead Soldering Paste for mid temperature