low temperature tin lead syringe solder paste for mobil phone

low temperature tin lead syringe solder paste for mobil phone 2.Lead-free Solder Paste 3.halogen free 4.less dross

   Shenzhen Jufeng Tin Product Co., Ltd. is specialized in producing and selling tin products, such as tin solder bars, tin solder wires, tin fat, anode stubs, soldering flux, apply machine water and cleaning agents. Our products are widely applicable to welding engineering of electron, communication, electric appliances, electric instruments and meters

2,Specification and chemistry component

Specification			SnAgCu
Appearance			Lucent,no dirt on surface
Weight			Net:about 20kg/box
Chemistry component
Sn	Ag	Cu	Pb	Sb	Bi	Zn	Fe	Al	As	Cd
96.5	3.0	0.5±0.2	<0.1	<0.02	<0.01	<0.02	<0.02	<0.02	<0.03	<0.02

Alloy component	Melting point	Proposion g/cm3	Rigidity HB	Conduct heat   M.S.K	Extend   Mpa	Extend rate %	Conductivity %
Sn96.5Ag3.0Cu0.5	227	7.4	9	64	32	48	16.0

3,Alloy component and physical characteristic

   Basic concept and characteristic of Solder products, solder  Paste   Solder paste is a cream-like mixture of solder alloy powder and flux/vehicle system;

   Solder paste should be rheological, i.e., its viscosity will decrease under the action of shear stress to favor the printing process but recover afterward to help to fix the electronic components before reflow;

   During the reflow process, the flux system will remove the surface oxidation layer and then the molten solder alloy will wet and react with the component terminal and metal pad on PCB and finally form the mechanical and electrical joining.

Technical Data Sheet

1,SnCu and SnPb capability balance

Component(wt%)		Sn96.5/Ag3.0/Cu0.5			Sn63/Pb37
Melting(oC)		227			183
Density(25 oC)		7.4			8.4
Heat cubage(J/kg · k)		220			176
Conduct heat (J/m · s · K)		64			50
Extend intension(MPa)		32			44
Extend Rate(%)		48			25
Resistance Rate(μΩm)		0.13			0.17
Extend Rate(%)	230 oC				91
	240 oC	77			92
	250 oC	77			93
	260 oC	77			93
	280 oC	78
Wetness Balance Test		Ta	Tb	Fmax	Ta	Tb	Fmax.
	240°C	1.00	4.53	0.159	0.12	0.80	0.195
	250°C	0.86	2.79	0.181	0.11	0.64	0.200
	260°C	0.47	1.46	0.186	0.10	0.41	0.206
	270°C	0.31	0.80	0.192	0.07	0.32	0.211

 

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