Shenzhen Jufeng Solder Co., Ltd.
Main products:solder wire,solder bar,solder paste
Products
Contact Us
  • Contact Person : Ms. Chen Lisa
  • Company Name : Shenzhen Jufeng Solder Co., Ltd.
  • Tel : 086-0755-89501587-809
  • Fax : 086-0755-89501292
  • Address : Guangdong,shenzhen,12#JingPeng Industry BuJI town Longgang Distric , Shenzhen
  • Country/Region : China
  • Zip : 518129

low temperature tin lead syringe solder paste for mobil phone

low temperature tin lead syringe solder paste for mobil phone
Product Detailed
low temperature tin lead syringe solder paste for mobil phone 2.Lead-free Solder Paste 3.halogen free 4.less dross

   Shenzhen Jufeng Tin Product Co., Ltd. is specialized in producing and selling tin products, such as tin solder bars, tin solder wires, tin fat, anode stubs, soldering flux, apply machine water and cleaning agents. Our products are widely applicable to welding engineering of electron, communication, electric appliances, electric instruments and meters

2,Specification and chemistry component

Specification

SnAgCu

Appearance

Lucent,no dirt on surface

Weight

Net:about 20kg/box

Chemistry component

Sn

Ag

Cu

Pb

Sb

Bi

Zn

Fe

Al

As

Cd

96.5

3.0

0.5±0.2

<0.1

<0.02

<0.01

<0.02

<0.02

<0.02

<0.03

<0.02

Alloy component

Melting point

Proposion g/cm3

Rigidity HB

Conduct heat

 

M.S.K

Extend

 

Mpa

Extend

rate

%

Conductivity %

 

Sn96.5Ag3.0Cu0.5

227

7.4

9

64

32

48

16.0

3,Alloy component and physical characteristic

   Basic concept and characteristic of Solder products, solder  Paste   Solder paste is a cream-like mixture of solder alloy powder and flux/vehicle system;

   Solder paste should be rheological, i.e., its viscosity will decrease under the action of shear stress to favor the printing process but recover afterward to help to fix the electronic components before reflow;

   During the reflow process, the flux system will remove the surface oxidation layer and then the molten solder alloy will wet and react with the component terminal and metal pad on PCB and finally form the mechanical and electrical joining.

Technical Data Sheet

1,SnCu and SnPb capability balance

Component(wt%)

Sn96.5/Ag3.0/Cu0.5

Sn63/Pb37

Melting(oC)

227

183

Density(25 oC)

7.4

8.4

Heat cubage(J/kg · k)

220

176

Conduct heat

(J/m · s · K)

64

50

Extend intension(MPa)

32

44

Extend Rate(%)

48

25

Resistance Rate(μΩm)

0.13

0.17

Extend Rate(%)

230 oC

91

240 oC

77

92

250 oC

77

93

260 oC

77

93

280 oC

78

Wetness Balance Test

Ta

Tb

Fmax

Ta

Tb

Fmax.

240°C

1.00

4.53

0.159

0.12

0.80

0.195

250°C

0.86

2.79

0.181

0.11

0.64

0.200

260°C

0.47

1.46

0.186

0.10

0.41

0.206

270°C

0.31

0.80

0.192

0.07

0.32

0.211

 

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